|
Subject/Product NO. |
Ag(%) |
Printing Method |
Firing Peak/Temp/time |
Firing Cycle |
Application |
Feature |
|
SP-100 |
60~80 |
Screen
Print250~350 mesh |
510℃~570℃10
10min |
60min |
PZT,elctrode and
PTC electrode |
Good adhesion and
Fire ability |
|
SP-200 |
55~65 |
Screen
Print250~350 mesh |
580℃~600℃10
min |
60min |
VFD |
Excellent
resolution and density |
|
SP-300 |
50~60 |
Screen
Print250~350 mesh |
750℃~820℃10
10min |
60min |
Disk ceramic
capacitor,NTC, Buzzer |
Metal
color,firing together,good
solder ability |
|
SP-400 |
60~80 |
Screen
Print250~350 mesh |
650℃/5min
or
800℃/20
sec |
30min 15~20min |
Aluminum
electrode for PTCR or solar cell |
Good
conductivity,thermal-humid
stability |
|
SP-500 |
60~80 |
Screen
Print250~350 mesh |
650℃/5分 |
30min |
PTC Ohm.contact |
Ohm.contact,thermal-humid
stability |
|
SP-600 |
60~80 |
Screen
Print250~350 mesh |
600℃/5分 |
60min |
Outer electrode
for chip component |
Platable,good
adhesion |
|
|
|
*Besides A1 paste,we also have the Pb-free
and Cr-free products for the same use. |
|
|
|
|
 Silver
Palladium Pastes |
| |
 Basic
characteristics |
|
Subject/Product NO. |
9001 |
9003 |
9005 |
9008 |
|
Content of metal(%) |
75~80 |
75~80 |
75~80 |
75~80 |
|
Ag/Pd |
99/1 |
97/3 |
95/5 |
92/28 |
|
Viscosity(µm) |
120~150 |
120~150 |
120~150 |
120~150 |
|
Firing Peak Temp(℃) |
850 |
850 |
850 |
850 |
|
Firing Peak Time(min) |
10 |
10 |
10 |
10 |
|
Firing Cycle(min) |
30~60 |
30~60 |
30~60 |
30~60 |
|
Fired Thickness(µm) |
8~11 |
8~11 |
8~11 |
8~11 |
|
Resistibility(mΩ)/□ |
3~5 |
3~5 |
4~7 |
8~11 |
|
Solder Wetability
(220+/-5℃,5''-8'') |
Excellent |
Excellent |
Excellent |
Excellent |
|
Solder Leach
(resistance,NO.Dips
60Sn/30Pb/2Ag,220+/-5℃) |
5~8 |
6~10 |
7~12 |
10~15 |
|
Adhesion(N/2*2mm2) |
＞40 |
＞40 |
＞40 |
＞40 |
|
|
|
*PL-Ag/Pd-9000 series,as conductive
materials for Hybrid
IC,resistors,networks,were idependently
developed with our unique technology. |
|
|
